# BLADE-INFRA Governance Node Project Guide ## Overview The BLADE-INFRA Governance Node is a ruggedized, secure computing platform designed for critical infrastructure protection, monitoring, and control in harsh industrial environments. It integrates an AI inference engine (Jetson Orin NX) with a robust FPGA governance processor (Zynq UltraScale+), secure elements, and extensive industrial sensor and communication interfaces for real-time data acquisition and distributed control of ICS/SCADA systems and power grids. ## Assumptions * **Power Source:** Primary AC mains (240V, 50/60Hz) with PoE++ and LiFePO4 battery backup for redundancy. * **Environment:** Industrial, outdoor deployment requiring IP65 rating, MIL-STD-461G EMC compliance, and -40°C to +70°C operational temperature. * **Skill Level:** Advanced hardware engineering and embedded systems expertise for PCB design, component integration, and system validation. * **Compliance:** All components and assembly steps must adhere to SIL 3, FIPS 140-2 Level 3, and NERC CIP standards. ## Action Items - [ ] Design and fabricate `custom_carrier_pcb` to integrate `jetson_orin_nx`, `zynq_ultrascale_plus_updated`, and various modules. - [ ] Integrate all power components: `24v_din_rail_psu`, `redundant_24v_din_rail_psu`, `poe_input_module`, `lifepo4_battery_pack_bms`, `spd_1`, `spd_2`, `reverse_polarity_ovp`, and `dc_power_harness` for redundant, protected power delivery. - [ ] Mount all DIN-rail components (`industrial_ethernet_switch`, `redundant_industrial_ethernet_switch`, `pilz_pnoz_s7_1_safety_relay`, `24v_din_rail_psu`, `redundant_24v_din_rail_psu`, `spd_1`, `spd_2`) within the `din_rail_industrial_enclosure`. - [ ] Connect `jetson_orin_nx` and `zynq_ultrascale_plus_updated` via `pcie_gen3_x4_cable` for high-speed data. - [ ] Integrate and connect all security modules: `microchip_atecc608b`, `infineon_optiga_tpm2_0`, `nshield_edge_hsm`, and `jtag_isolation_switch` with physical `jtag_lockout_keyed_switch`. - [ ] Install and wire all external sensors (`ct_sensor_phase_a` through `ct_sensor_neutral`, `pt_sensor_phase_a` through `pt_sensor_phase_c`, `ultrasonic_flow_sensor_1`, `pressure_transducer_1`, `rtd_temperature_probe_1`, `capacitive_humidity_sensor_1`, `multi_gas_detector`, `radar_level_sensor_updated`) to the `custom_carrier_pcb` via appropriate transceivers and ADC inputs. - [ ] Configure and connect all communication modules (`anybus_b40_modbus_ethernet`, `sierra_wireless_hl7802`, `iridium_9603_sbd`, `esp32_s3_wifi_ble`, `ieee1588_ptp_nic`, `hilscher_netx90_profinet_updated`, `isolated_can_transceiver`). - [ ] Integrate `u_blox_zed_f9t_gnss` and `ocxo_oscillator` for PTPv2 synchronization. - [ ] Apply `conformal_coating` to `custom_carrier_pcb` and ensure all external penetrations use `m12_circular_connector` or `m20_cable_gland` with `emi_emc_gaskets`. - [ ] Install `thermoelectric_cooler_heatsink` with `thermal_paste_jetson_zynq` for thermal management, ensuring proper heat rejection from `din_rail_industrial_enclosure`. - [ ] Affix `tamper_evident_seals_set` to all access points of the `din_rail_industrial_enclosure` post-assembly. ## Assembly Key Points | Component A | Component B | Key Considerations | | :---------------------------------- | :------------------------------------ | :------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ | | `jetson_orin_nx` | `custom_carrier_pcb` | Secure via `SO-DIMM 260-pin socket` and `m2_standoffs_jetson` with proper thermal interface via `thermal_pad_jetson` and `thermal_paste_jetson_zynq`. | | `zynq_ultrascale_plus_updated` | `custom_carrier_pcb` | Secure via `Board-to-board connectors` with proper thermal interface via `thermal_pad_zynq` and `thermal_paste_jetson_zynq`. | | `custom_carrier_pcb` | `din_rail_industrial_enclosure` | Mount using `din_rail_clips` and `m3_screws_for_pcb_mounts` for robust retention and EMI grounding via `emi_emc_gaskets`. | | `thermoelectric_cooler_heatsink` | `custom_carrier_pcb` | Optimal placement for `jetson_orin_nx` and `zynq_ultrascale_plus_updated` cooling. Use `thermal_paste_jetson_zynq` for efficient heat transfer. Bolted flange to `din_rail_industrial_enclosure` for external heat rejection. | | `u_blox_zed_f9t_gnss` | `enclosure_roof_antenna_mount` | Ensure clear line of sight for GNSS antenna. Use `sma_bulkhead_antenna_gps` for weather-sealed pass-through and secure antenna connection. | | `sierra_wireless_hl7802` | `din_rail_industrial_enclosure` | Utilize `sma_bulkhead_antenna_cellular` (x2 for MIMO) for antenna pass-through, ensuring proper sealing against IP65. | | `iridium_9603_sbd` | `enclosure_roof_antenna_mount` | Mount with unobstructed sky view. Use `tnc_bulkhead_antenna_iridium` for robust, weather-sealed connection. | | `pilz_pnoz_s7_1_safety_relay` | `din_rail_industrial_enclosure` | Securely mount on DIN rail using its `din_rail_mount_safety_relay`. Verify SIL 3 wiring practices for `Safety_I/O_In_1` and `Safety_Out_1`. | | `multi_gas_detector` | `din_rail_industrial_enclosure` | Route `sampling_tube_gas_detector` via `m20_cable_gland` to `pipeline_sampling_tap` ensuring gas-tight seal and environmental protection. | | `ct_sensor_phase_a` | `power_conductor_split_core` | Correctly clamp around the respective `power_conductor_split_core` for accurate current measurement. Verify phasing. | | `pt_sensor_phase_a` | `voltage_bus_bar_pt` | Securely mount and connect to `voltage_bus_bar_pt` with proper insulation and fusing for safety and accuracy. | | `ultrasonic_flow_sensor_1` | `pipeline_flow_pressure` | Clamp-on ultrasonic straps for non-invasive measurement on `pipeline_flow_pressure`. Ensure correct spacing and coupling gel for optimal signal. | | `rtd_temperature_probe_1` | `thermowell_rtd` | Insert into `thermowell_rtd` and secure with `compression_fitting_rtd` for process integration and protection. Ensure sufficient immersion. | | `tamper_evident_seals_set` | `din_rail_industrial_enclosure` | Apply strategically to all access panels, covers, and cable glands to meet FIPS 140-2 Level 3 and NERC CIP requirements. Document seal states. | | `jtag_isolation_switch` | `jtag_lockout_keyed_switch` | Integrate `jtag_lockout_keyed_switch` for physical control and isolation of JTAG debug --- © 2026 Burak Oktenli · Georgetown University MPS-AI · ORCID: 0009-0001-8573-1667 License: Creative Commons Attribution 4.0 International (CC BY 4.0)